• Romilkumar D Patel
• Chintankumar J Patel
• Pratik R Patel

Thermal conductivity has many important applications in heat transfer, food material and engineering. In small industries and HMT labs of engineering colleges, the accurate measurement of thermal conductivity is required. This review paper regards with different method for measuring thermal conductivity with respect to different materials. Due to impurities and imperfect mating surfaces, the air is trapped between mating surface of material especially in composite material. So it is required to study different methods and best suitable method can be stated. The different method as a finite element method, transient plane source method, sintering of reaction-bonded silicon nitride (SRBSN) method and Transient methods can be used to calculate thermal conductivity of the material.

Thermal conductivity, Temperature, inter-facial resistance.

"A Review Paper on MEASURE THERMAL CONDUCTIVITY", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.3, Issue 2, page no.51-53, February-2016, Available :http://www.jetir.org/papers/JETIR1602011.pdf

"A Review Paper on MEASURE THERMAL CONDUCTIVITY", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.3, Issue 2, page no. pp51-53, February-2016, Available at : http://www.jetir.org/papers/JETIR1602011.pdf