JETIREXPLORE- Search Thousands of research papers



Published in:

Volume 5 Issue 1
January-2018
eISSN: 2349-5162

Unique Identifier

JETIR1801241

Page Number

1291-1293

Share This Article


Title

Anionic Complexes of Nickel (II) and Copper (II) Containing Schiff Bases

ISSN

2349-5162

Cite This Article

"Anionic Complexes of Nickel (II) and Copper (II) Containing Schiff Bases", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.5, Issue 1, page no.1291-1293, January-2018, Available :http://www.jetir.org/papers/JETIR1801241.pdf

Abstract

A series of complexes of the type M'[M (B.B')] where M = tetramethyl ammonius (Me4N+) or cetylpyridinium chloride (Cepy+), M =Ni(II), Co(II), BB' = bi-negative tridentate ligands such as salicylaldehyde thiosemicabazone, salicylaldehyde o-amino phenol and salicylaldehyde anthranilic acid have been isolated in non-aqueous medium. The compounds were characterised on the basis of their elemental analyses, molecular weight, conductivity, magnetic moment, infrared and electronic spectra data.

Key Words

Cite This Article

"Anionic Complexes of Nickel (II) and Copper (II) Containing Schiff Bases", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.5, Issue 1, page no. pp1291-1293, January-2018, Available at : http://www.jetir.org/papers/JETIR1801241.pdf

Publication Details

Published Paper ID: JETIR1801241
Registration ID: 303871
Published In: Volume 5 | Issue 1 | Year January-2018
DOI (Digital Object Identifier):
Page No: 1291-1293
ISSN Number: 2349-5162

Download Paper

Preview Article

Download Paper




Cite This Article

"Anionic Complexes of Nickel (II) and Copper (II) Containing Schiff Bases", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.5, Issue 1, page no. pp1291-1293, January-2018, Available at : http://www.jetir.org/papers/JETIR1801241.pdf




Preview This Article


Downlaod

Click here for Article Preview