• V.sundara Mahalingam
• Dr. G.Kumaraguruparan

High heat flux on a chip or high temperature region on a chip called HOTSPOTS. Based on HOTSPOT maximum chip temperature & how much power need to allow in chip will calculated i.e. Thermal Design Power (TDP). Therefore electronic device needs to process on uniform surface temperature for good performances. The existing cooling methods requires heat sink & Air to cool a chip, this leads to more power requirement & affect the system efficiency. Because of the time-varying Nature of the power dissipation, additional localized cooling can be provided only when hot spots appear & the maximum Temperature can be reduced. This is referred to as on-demand Cooling which could achieve by thermoelectric module (heat pump).The scope of the work is to fabricate an experimental analytical model based on core 2 duo new floor plan. Which had the uneven temperature on cores zone 91 (hotspots) & cache zone 61 . Therefore to develop an aluminum heat load is based on core 2 duo floor plan. The TEC device placed on respective hotspots zone & heat sink is placed in all 4 zones which are coupled with CPU cooling fan. The experimental analysis takes place based on hotspot appear on the heat load surface. The devices are actuated by maximum cooling based control algorithm, for to remediate hotspot when its appears. Therefore the hotspot temperature reduced close to the cache area temperature, (i.e.) uniform surface temperature is achieved by without affecting the device reliability

Hotspots, Thermal Design Power (TDP), On Demand Cooling, Thermo Electric Coolers (TEC)

"DYNAMIC SMART COOLING SYSTEM FOR HOTSPOT REMEDIATION USING THERMO ELECTRIC COOLERS : (AN EXPERIMENTAL STUDY)", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.5, Issue 6, page no.8-15, June-2018, Available :http://www.jetir.org/papers/JETIRC006002.pdf

"DYNAMIC SMART COOLING SYSTEM FOR HOTSPOT REMEDIATION USING THERMO ELECTRIC COOLERS : (AN EXPERIMENTAL STUDY)", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.5, Issue 6, page no. pp8-15, June-2018, Available at : http://www.jetir.org/papers/JETIRC006002.pdf