• Shubham Parihar
• Ravindra Randa

As technology improves in the field of electronic devices, the cooling of electronic chips is a more significant and challenging issue to be dealt with. With the developments in the field of CFD technologies, it became possible to achieve the optimum cooling performance solution for a designed system in terms of material, size, and shape by computational analysis. The increasing heat load of the device needs to be removed for maintaining the efficient performance of the device. In air-cooled systems, the thermal management systems (i.e. heat sink) are optimized to attain the highest performance in a given space. Adding fins to the heat sink increases its surface area which reduces the heat transfer coefficient of the system. For better performance, a number of fins in a given area is used to optimize the effective performance of the CPU. In this study, a stock heat sink with a central core of different materials and varying heights is analyzed and compared. For analysis flow simulation software, SolidWorks is used to determine the thermal performance of the heat sink. A CPU chip is taken as a volume source of heat power of 65W, ambient temperature is taken as 32 ℃ since the system is already surrounded by other components in the system responsible for increased surrounding temperature. The airspeed produced by the CPU fan is accepted as 1 m/s. Aluminum alloys and Copper is used as heat sink material for this analysis. Further, the results of maximum chip temperature and minimum heat sink temperature for various heat sink geometry are compared and plotted the maximum chip temperature graph for selection of optimal geometry.

Heat SInk, Solidworks, CFD, Flow Analysis, Thermal Management System

"Thermal Analysis of Heat Sink Using Solidworks", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.8, Issue 10, page no.b167-b175, October-2021, Available :http://www.jetir.org/papers/JETIR2110119.pdf

"Thermal Analysis of Heat Sink Using Solidworks", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.8, Issue 10, page no. ppb167-b175, October-2021, Available at : http://www.jetir.org/papers/JETIR2110119.pdf