• D. MAVEEN
• P. ADITYA VARDHAN
• S. SIVA KOTESWARA RAO
• A. JAGADEESH REDDY
• E. SAI KALYAN, DR. S. SUDHAKAR BABU

Heat dissipation is becoming more and more challenging with the preface of increased miniaturization of electronic components having staggering heat generation levels. So efficient cooling of the electronic devices becomes a challenging task in thermal area .Innovation in technology has made a large leap towards compact, so equipment size variation has changed to miniature size. For optimum working condition of electronic systems energy-efficient heat sink is needed. To overcome the problem of overheating, numerous heat sink designs are proposed including straight plate fin heat sink. Finned Heat Sinks are used to cool power Electronic Components The temperature difference is analyzed to get better understanding of heat transfer from the sink to ambient air. Three-dimensional numerical simulations with different parameters will be studied for the straight plate-add fin heat sinks model in forcedconvection regime. The results obtained through ANSYS. We had performed steady state thermal analysis here. Comprehensive parametric studies will be performed by varying parameters such as thermal conductivity, convection heat transfer coefficient, emissivity, etc. on temperature distribution.

Thermal analysis, Plate fin heat sink, Heat transfer, ANSYS.

"THERMAL ANALYSIS OF A STRAIGHT PLATE FIN HEAT SINK", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.10, Issue 1, page no.e103-e111, January-2023, Available :http://www.jetir.org/papers/JETIR2301424.pdf

"THERMAL ANALYSIS OF A STRAIGHT PLATE FIN HEAT SINK", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.10, Issue 1, page no. ppe103-e111, January-2023, Available at : http://www.jetir.org/papers/JETIR2301424.pdf