• Nakka Srinivasa Rao
• N.Gurumurthy
• B.Srikanth
• B S S Phanisankar

The electronic components have been ruling the world since few decades. They have made its way into practically every aspect of modern life, from toys and appliances to high speed computers. The number of transistors mounted on a chip gets doubled for every two years. As the number of transistors increase with development of chip integration technology increases the power draw and heat load to dissipate during operation increases. With the development of chip integrated circuits gradual decrease in size of the components has resulted drastic increase in the amount of heat generation per unit volume. Unless they are properly designed and controlled high rates of heat generation result in the failure of electronic component due to high operating temperature. To dissipate the heat many cooling methods have been developed, but among that liquid cooling has the ability to dissipate more heat from the parts being cooled than the various types of metals used in heat sinks, making it suitable for over clocking and high performance computer applications. Advantages to water cooling include the fact that a system is not limited to cooling one component, but can be set up to cool the central processing unit, graphics processing unit, and/or other components at the same time with the same system. Among the all working fluids water has an obvious advantage in heat transfer because of its distinctive physical properties. The saturation temperature of water is about 373K. But, the surface of the component is below the saturation temperature of water. So, some substitute medium instead of water was used. An active cooling solution using propylene glycol as a coolant is proposed for electronic components, a series of experiments under different proportions of water and propylene glycol were performed to evaluate the heat dissipation performance of the liquid cooling system and the results were compared with that of water. After conducting the experiments it is decided that the cooling performance of the liquid cooling system is increased by adding propylene glycol to pure water.

heat transfer , non contact type , liquid cooling, polyethelene glycol

"Experimental Investigation on Heat Transfer of Non-Contact Liquid Cooling By the Mixture of Water and Propylene Glycol", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.6, Issue 6, page no.160-165, June 2019, Available :http://www.jetir.org/papers/JETIR1907480.pdf

"Experimental Investigation on Heat Transfer of Non-Contact Liquid Cooling By the Mixture of Water and Propylene Glycol", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.6, Issue 6, page no. pp160-165, June 2019, Available at : http://www.jetir.org/papers/JETIR1907480.pdf