• Bheemrao D Wadekar
• sampath kumar

In the present study, Optimizing the design of Heat sink in the electronics cooling assembly is investigated using Computational fluid dynamics and Numerical parametric optimization techniques. Objective of this optimization is to decrease the maximum temperature on the heat sink surface by varying the different input design parameters such as number of fins, Distance between the fins and length of the heat sink base plate. Multi-objective numerical optimization method is used to drive and decide the input parameter values without any user interaction to arrive at the best possible solution with least amount of time. Optimized results obtained from this numerical optimization is compared with base design results for performance improvements.

"Parametric Optimization of Heat Sink Using Multi-Objective Optimization Method", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.6, Issue 6, page no.342-346, June 2019, Available :http://www.jetir.org/papers/JETIR1907E50.pdf

"Parametric Optimization of Heat Sink Using Multi-Objective Optimization Method", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.6, Issue 6, page no. pp342-346, June 2019, Available at : http://www.jetir.org/papers/JETIR1907E50.pdf