• Srinivas.D.
• Dr S.Ramamurthy.
• Ms Juhi.A.

A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations,optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results

Base plate,Cooling fan, CFD simulation, Heat sink, Heat dissipation, IC’s ,Fin configuration, Thermocouples. ______________________________________________________________________________________________

" Forced Convection Upon Heat Sink of AL-Cu For Design Optimization by Experimental and CFD analysis for cooling of ICs in CPU. ", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.6, Issue 6, page no.412-418, June 2019, Available :http://www.jetir.org/papers/JETIR1907F55.pdf

" Forced Convection Upon Heat Sink of AL-Cu For Design Optimization by Experimental and CFD analysis for cooling of ICs in CPU. ", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.6, Issue 6, page no. pp412-418, June 2019, Available at : http://www.jetir.org/papers/JETIR1907F55.pdf