• V. T. Bhugul
• Dr. A. B. Naik

Abstract: The advanced microelectronic packing requirement are passing on the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. The efforts have been focused on the direction of synthesis and characterization of novel polymers with the goal of high thermal stability, high mechanical strength, low water absorption rate, solubility in selected organic solvents, low dielectric constant and low coefficient of thermal expansion. These stringent combined goals have been largely achieved by synthesizing novel poly(arylene ether)s and Poly(Ether Imide)s containing rigid terphenyl units in the polymer chain and pendent trifluoromethyl groups. This novel polymer exhibited outstanding thermal stability, tensile strength, negligibly small water absorption rate even after submersion in boiling water for several days. It also exhibited low dielectric constant and have optical clarity. Therefore this novel material can be consider for use in numerous applications which requires for high –performance aerospace material as well as inter layer dielectric for advanced microelectronic applications.

Polyethers, Polyamides

"synthesis of novel poly(arylene ether)s and poly(ether imide)s supported with trifluoromethyl for microelectronic applications", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.6, Issue 6, page no.748-751, June 2019, Available :http://www.jetir.org/papers/JETIR1908578.pdf

"synthesis of novel poly(arylene ether)s and poly(ether imide)s supported with trifluoromethyl for microelectronic applications", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.6, Issue 6, page no. pp748-751, June 2019, Available at : http://www.jetir.org/papers/JETIR1908578.pdf