• Shabeeb Muhammad TP
• Gaurav Vyas
• Raja Sekhar Dondapati

Continuous miniaturization and high-end demand for digital devices and appliances have contributed to a dramatic rise in heat flux generation. As a result, traditional coolants and cooling methods are increasingly falling short of meeting the ever-increasing cooling requirements and challenges of these electronic devices that produce high heat. In this article, the recent studies performed on the use of channels in microelectronic devices, electronic devices, and refrigeration cooling applications are reviewed. Another intention behind this review is to explain the challenges of different design for channels for electronic cooling. Many researchers have reported on micro/mini channel heat sinks for cooling electronics for the past 5 years. Furthermore, the prospects for future study and the issues emerging in this field are introduced and explored.

Microelectron, Electronics, Refrigeration.

"A review on channels for cooling applications", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.7, Issue 12, page no.57-63, December-2020, Available :http://www.jetir.org/papers/JETIR2012208.pdf

"A review on channels for cooling applications", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.7, Issue 12, page no. pp57-63, December-2020, Available at : http://www.jetir.org/papers/JETIR2012208.pdf