UGC Approved Journal no 63975(19)

ISSN: 2349-5162 | ESTD Year : 2014
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Published in:

Volume 9 Issue 8
August-2022
eISSN: 2349-5162

UGC and ISSN approved 7.95 impact factor UGC Approved Journal no 63975

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Published Paper ID:
JETIR2208465


Registration ID:
501662

Page Number

e577-e580

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Title

A Review on thermal behavior of Heat sink with effect of optimized configurations

Abstract

Here in this work, it review the different performance parameters of heat sink and also reviews the used of different use of heat sink A heat sink is a passive heat exchanger that transfers heat. Heat sink is an electronic component or a device of an electronic circuit which disperses heat from other components (mainly from the power transistors) of a circuit into the surrounding medium and cools them for improving their performance, reliability and also avoids the premature failure of the components. The device transfers heat to the heat sink by conduction. The heat sink is typically a metallic part which can be attached to a device releasing energy in the form of heat, with the aim of dissipating that heat to a surrounding fluid in order to prevent the device overheating. The primary mechanism of heat transfer from the heat sink is convection, although radiation also has a minor influence.

Key Words

Heat sink, Review, heat transfer, performance parameters.

Cite This Article

"A Review on thermal behavior of Heat sink with effect of optimized configurations", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.9, Issue 8, page no.e577-e580, August-2022, Available :http://www.jetir.org/papers/JETIR2208465.pdf

ISSN


2349-5162 | Impact Factor 7.95 Calculate by Google Scholar

An International Scholarly Open Access Journal, Peer-Reviewed, Refereed Journal Impact Factor 7.95 Calculate by Google Scholar and Semantic Scholar | AI-Powered Research Tool, Multidisciplinary, Monthly, Multilanguage Journal Indexing in All Major Database & Metadata, Citation Generator

Cite This Article

"A Review on thermal behavior of Heat sink with effect of optimized configurations", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.9, Issue 8, page no. ppe577-e580, August-2022, Available at : http://www.jetir.org/papers/JETIR2208465.pdf

Publication Details

Published Paper ID: JETIR2208465
Registration ID: 501662
Published In: Volume 9 | Issue 8 | Year August-2022
DOI (Digital Object Identifier):
Page No: e577-e580
Country: bhopal, Madhya pradesh, India .
Area: Engineering
ISSN Number: 2349-5162
Publisher: IJ Publication


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