• Hariom Thakur
• Sinsha Prakash P K

As technology improves daily, investigations and studies are being done to improve the efficiency of cooling electronic devices like PCBs and the internal electronic components of projectors. The goal of this work is to give electrical gadgets a better cooling environment. To improve the heat transfer through forced convection, the location of a fan or blower installed in them is changed. When an electronic device's cooling system is constructed properly, it can quickly dissipate the high heat produced at maximum load, improving reliability. The flow behaviour is visualised using a turbulence model. This investigation is carried out using the SimFlow software with paraview. This research will help in forecasting the ideal circumstances for cooling model production for electronic systems. The three geometry files that were chosen are pins, CPU, and board.stl.Geometrics were generated in stl with X=0.0899m, Y=0.0584m, and Z=0.018m, which indicates that the blockage ratio almost ranges from 0.01 to 0.05. Geometry Fan origin was created with dimensions in (m) [0.016, 0.016, 4e-03]. Since STL doesn't preserve unit information, the imported geometry is in that format.

"Case studies of electronics cooling", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.10, Issue 5, page no.n455-n462, May-2023, Available :http://www.jetir.org/papers/JETIR2305D66.pdf

"Case studies of electronics cooling", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.10, Issue 5, page no. ppn455-n462, May-2023, Available at : http://www.jetir.org/papers/JETIR2305D66.pdf