• SHANIGARAM POCHAIAH
• Dr. K.VASANTHA KUMAR

In modern times, compressed and high power-density electronic appliances (100 W/cm2) have drawn significant attention in recent high-end electronic applications. During the application, the chip generates heat energy. It usually operates on baseload and does not produce high heat rates all the time. However, it may dissipate extra heat load for a certain period for various reasons. This additional high heat rate needs to be dissipated efficiently; otherwise, it may lead to malfunctioning. Therefore, a unique and efficient cooling technique based on phase change material is desirable to tackle extra heat load. 2D expanded graphite and h-BN loaded eutectic-based phase change material (WG-EPCM) was developed through the melt-mixing process. The h-BN's quantity (wt. %) was varied to observe its effect on thermo-mechanical and thermal heat storage characteristics. Overall, the addition of h-BN leads to a significant increase in thermal conductivity. Differential scanning calorimetry was deployed to study heat storage capacity and transition temperature. The study on thermal conductivity, heat storage and phase transition temperature of WG-EPCM will be presented in detail.

White graphene, Eutectics, Phase change materials, Heat storage, Thermal conductivity

"2D Hexagonal Boron Nitride-Loaded Eutectic Phase Change Materials Based Heat Sink for Thermal Management", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.10, Issue 7, page no.e361-e366, July-2023, Available :http://www.jetir.org/papers/JETIR2307436.pdf

"2D Hexagonal Boron Nitride-Loaded Eutectic Phase Change Materials Based Heat Sink for Thermal Management", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.10, Issue 7, page no. ppe361-e366, July-2023, Available at : http://www.jetir.org/papers/JETIR2307436.pdf