• Agatha Ifeoma Ijomah
• Kingsley C. Nnakwo
• Jerome U. Odo
• Ifeanacho U. Okeke

Solid solution strengthening generally improves the strength of the material, making it more resistant to deformation and fracture under applied loads. In this study, microstructure, impact, and electrical behavior of fine grained Cu-Si-(Mg, Ti) alloy after solid solution strengthening are studied. The impact energy, density, and electrical conductivity of the fabricated Cu-Si-(Mg, Ti) alloys were investigated. The microstructure analysis was done using optical metallurgical microscope (OM). Results indicated that magnesium and titanium induced increased precipitation of fine grains in the copper matrix, resulting to improvements of both the impact energy and electrical conductivity of the alloys, especially in the magnesium doped Cu-3Si alloy.Solution heat treatment enhanced the grain refinement and distribution in the alloy structure. This guaranteed the further increase in impact energy of the Cu-Si-(Mg, Ti) alloy, with maximum values of 34.2 J and 25.6 J, respectively. The as-cast Cu-3Si-3Mg recorded maximum electrical conductivity of 28.55 S/m. Both alloys recorded higher density at all conditions compared with the parent alloy.

Microstructure; magnesium; titanium; impact energy; density.

"Microstructure, impact and electrical behavior of fine grained Cu-Si-(Mg, Ti) alloy after solid solution strengthening", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.10, Issue 9, page no.c590-c597, September-2023, Available :http://www.jetir.org/papers/JETIR2309265.pdf

"Microstructure, impact and electrical behavior of fine grained Cu-Si-(Mg, Ti) alloy after solid solution strengthening", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.10, Issue 9, page no. ppc590-c597, September-2023, Available at : http://www.jetir.org/papers/JETIR2309265.pdf