• Animireddy Konadababu

Heat pipes are the most effective passive method of transferring heat available today. In their simplest form, a heat pipe is a sealed tube containing a phase-change fluid. Different working fluids are used to suit various temperature ranges. When there is temperature difference in two air streams of each end of the heat pipes, hot air stream applied to one end of the heat pipe, heat boils the inside fluid causing it to change phase from liquid to gas. This vaporization process absorbs large amounts of heat from hot the air stream. Vapor then travels to the other end of the heat pipe, where another air stream with the lower temperature causes the working fluid to condense and release the heat to the cold airflow. Fluid return is normally accomplished by gravity. The constant circulation of evaporating and condensing of the working fluid is the principle of heat pipes heat transfer. In this work, the new design structure and cooling methods have been proposed based on the few research gaps as mentioned. Three different structure of channel heat sink are designed and analyzed by using CATIA v5, and commercial CFD software. Six-channel heatsink with CuO/water and TiO2/water nanofluids as coolants are considered for this study at different volume concentration (0.25%, 0.50% and 0.75%).

Heat sink, Heat pipe, VLSI Cooling, Ansys Fluent, Electronics Cooling

"Improved Cooling of VLSI Circuits with Heat Sinks and Nanofluids", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.11, Issue 10, page no.e618-e625, October-2024, Available :http://www.jetir.org/papers/JETIR2410466.pdf

"Improved Cooling of VLSI Circuits with Heat Sinks and Nanofluids", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.11, Issue 10, page no. ppe618-e625, October-2024, Available at : http://www.jetir.org/papers/JETIR2410466.pdf