UGC Approved Journal no 63975(19)

ISSN: 2349-5162 | ESTD Year : 2014
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Published in:

Volume 5 Issue 9
September-2018
eISSN: 2349-5162

UGC and ISSN approved 7.95 impact factor UGC Approved Journal no 63975

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Published Paper ID:
JETIRB006077


Registration ID:
186980

Page Number

431-435

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Title

Analysis of Failure Encountered by IC Substrate and Plastic Package

Abstract

This paper presents the review on the work done on failure analysis mainly with respect to temperature and humidity. The pressure failure mode include package delamination ,solder abnormality and moisture ingress. After studying their impact,source prevented measures and improvements suggested have been studied.

Key Words

plastic packaging, delamination, solder abnormalityˈ moisture ingress, failure analysis technology, IC substrate

Cite This Article

"Analysis of Failure Encountered by IC Substrate and Plastic Package", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.5, Issue 9, page no.431-435, September-2018, Available :http://www.jetir.org/papers/JETIRB006077.pdf

ISSN


2349-5162 | Impact Factor 7.95 Calculate by Google Scholar

An International Scholarly Open Access Journal, Peer-Reviewed, Refereed Journal Impact Factor 7.95 Calculate by Google Scholar and Semantic Scholar | AI-Powered Research Tool, Multidisciplinary, Monthly, Multilanguage Journal Indexing in All Major Database & Metadata, Citation Generator

Cite This Article

"Analysis of Failure Encountered by IC Substrate and Plastic Package", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.5, Issue 9, page no. pp431-435, September-2018, Available at : http://www.jetir.org/papers/JETIRB006077.pdf

Publication Details

Published Paper ID: JETIRB006077
Registration ID: 186980
Published In: Volume 5 | Issue 9 | Year September-2018
DOI (Digital Object Identifier):
Page No: 431-435
Country: Udaipur, Rajasthan, India .
Area: Science & Technology
ISSN Number: 2349-5162
Publisher: IJ Publication


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