• Minesh Vohra
• Sanjeev Kumar

Abstract: In the present paper the work has been carried out on efficient heat sink for cooling of electronic devices. For this purpose, A numerical simulated model has been the analyzed in order to choose the suitable fin geometry for maximum heat dissipation from the microchip surface. The ANSYS Fluent module was used to produce a CFD heat transfer simulation. In the fin array region of the heat sink, a thermal gradient system was introduced. An effective grid consistency model has been developed and validated based on Grid Independence. The simulated investigation with variable fin geometries i.e. Fin 1, Fin 2, Fin 2, Fin 4; showed that the water was adequate to cool the CPU with the specified fin configuration, i.e. Fin 2 having elements (1.25E+06) and the maximum surface temperature of the Microchip obtained is 291.167K which is minimum in comparison to rest of the fin geometries.

Keywords: Fins, Heat Transfer Rate, CFD Analysis, Hardware, Cooling of Electronic Devices

"Numerical Simulation and Investigation of an Electronic Cooling System Utilizing Extended Surfaces", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.5, Issue 11, page no.360-366, November 2018, Available :http://www.jetir.org/papers/JETIRDS06057.pdf

"Numerical Simulation and Investigation of an Electronic Cooling System Utilizing Extended Surfaces", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.5, Issue 11, page no. pp360-366, November 2018, Available at : http://www.jetir.org/papers/JETIRDS06057.pdf