• Rabindra Nath Shaw

Over the last few years, flexible electronics has advanced significantly as devices and circuits have begun to appear from Nano-scale structures to printed thin films. At the same time, demand for high-performance electronics has also increased, due to the need for flexible and compact integrated circuits to achieve fully flexible electronic systems. Obtaining flexible and lightweight integrated circuits is challenging as the silicon-based CMOS circuitry, which is currently the industry standard for high-performance, is planar and silicon's brittle nature makes bendability difficult. The ultra-thin silicone chips are gaining popularity for this purpose. This study offers an in-depth analysis of different approaches to produce ultra-thin silicon wafer chips. The comprehensive study discussed here involves consideration of the characteristics of ultra-thin chips such as electrical, thermal, optical and mechanical properties, stress modeling and packaging techniques. The fundamental developments in areas such as sensing, computation, data storage, and energy were addressed along with several emerging applications (e.g., wearable devices, m- Health, smart cities, and the Internet of Things, etc.) that they will enable.

CMOS, Flexible electronics, Thin film, Thin film chips.

"A Review on Thinning Mythologies for Ultra-Thin Chips for Flexible Electronics", International Journal of Emerging Technologies and Innovative Research (www.jetir.org), ISSN:2349-5162, Vol.6, Issue 2, page no.374-380, February-2019, Available :http://www.jetir.org/papers/JETIREO06090.pdf

"A Review on Thinning Mythologies for Ultra-Thin Chips for Flexible Electronics", International Journal of Emerging Technologies and Innovative Research (www.jetir.org | UGC and issn Approved), ISSN:2349-5162, Vol.6, Issue 2, page no. pp374-380, February-2019, Available at : http://www.jetir.org/papers/JETIREO06090.pdf